Industrial Technical Center for Plastics and Composites

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Research

ELIPPSE


Lancement
01/10/2016

Durée
36 months

Financeur(s)
UE

Budget global
2,6 M €


Objective

The aim of the ELIPPSE project is to develop an innovative technology for integrating functional film with printed electronics and non-printed components onto 3D plastic parts with complex geometric shapes. This technology will enable the production of high-added-value plastronic parts that closely integrate electronic and mechanical functions. The technology developed uses overmoulding, screen printing, component transfer, adapted ink formulation and thermoforming processes. As part of the ELIPPSE project, it is being applied to the field of energy management.

 

Challenges

  • Development and optimisation of the overmoulding process for printed electronics.
  • Modelling and simulation for film overmoulding to enable the design of film-based electronic architectures.
  • Design of tools and automation related to overmoulding processes.

 

Project funded by:

Elippse is co-financed by the European Union as part of the FEDER-FSE Rhône-Alpes 2014-2020 operational programme.
More details

Labelling cluster

Plastipolis • Minalogic

Plastipolis
Minalogic

Partenaires

Schneider ElectricArc En Ciel SérigraphiePlastiformVFP Ink TechnologiesLaMCoSMINESIPC

Schneider Electric
Arc En Ciel Sérigraphie
Plastiform
VFP Ink Technologies
LaMCoS
MINES
IPC
Carnot InstituteCTI NetworkISO 9001 SGS