PENELOPE

Challenge:

To develop the digitalisation and modularity of assembly and repair procedures for large components.

Objectives

• To digitalise production lines for large-scale equipment.
• To automate and provide flexibility to production lines for large parts.
• Creation of digital twins:

1. Simulation of assembly processes
2. Zero-defect manufacturing

• Integrating component repair (in situ)

The role of IPC

• Contributing to VDL’s pilot line (bus).
• Automated repair of composite parts (in-situ).
• Simulation and control of the RTM process.

Partenaires

CEA • Cecimo • Eire Composites • TopSolid • Albéa • IPC • Siemens • Sculpteo • Innovalia • NIT • Exom Engineering • Tecnalia • Aimen • Intrasoft • Technology Transfer System • Comau • Politecnico Milano • LMS • Fill • Swiss Smart Factory • Schaltag • SmartFactory • DFKI • ESI Group • FundingBox • TNO • [Placeholder] • VDL • Philips